SAM3U2E Atmel Corporation, SAM3U2E Datasheet - Page 390
SAM3U2E
Manufacturer Part Number
SAM3U2E
Description
Manufacturer
Atmel Corporation
Specifications of SAM3U2E
Flash (kbytes)
128 Kbytes
Pin Count
144
Max. Operating Frequency
96 MHz
Cpu
Cortex-M3
# Of Touch Channels
57
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
5
Twi (i2c)
2
Uart
5
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
36
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
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Figure 25-34. Read Enable Timing Configuration Working with NAND Flash Device
Figure 25-35. Ready/Busy Timing Configuration
390
390
mck
cle
mck
wen
cen
ale
ren
ren
rbn
SAM3U Series
SAM3U Series
Use TWB field in SMC_TIMINGS register to configure the maximum elapsed time between the
rising edge of wen signal and the falling edge of rbn signal. Use TRR field in the SMC_TIMINGS
register to program the number of clock cycle between the rising edge of the rbn signal and the
falling edge of ren signal.
• Ready/Busy Signal Timing configuration working with a NAND Flash device
t
WB
t
AR
busy
t
CLR
t
REN_SETUP
t
REN_CYCLE
t
t
REN_PULSE
RR
t
REH
6430E–ATARM–29-Aug-11
6430E–ATARM–29-Aug-11
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