SAM9G20 Atmel Corporation, SAM9G20 Datasheet - Page 777
SAM9G20
Manufacturer Part Number
SAM9G20
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(248 pages)
2.SAM9261.pdf
(1274 pages)
3.SAM9261.pdf
(43 pages)
4.SAM9G20.pdf
(42 pages)
5.SAM9G20.pdf
(832 pages)
Specifications of SAM9G20
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
7
Ssc
1
Ethernet
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
Yes
Adc Channels
4
Adc Resolution (bits)
10
Adc Speed (ksps)
95
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
32khz Rtc
Yes
Calibrated Rc Oscillator
No
- SAM9261 PDF datasheet
- SAM9261 PDF datasheet #2
- SAM9261 PDF datasheet #3
- SAM9G20 PDF datasheet #4
- SAM9G20 PDF datasheet #5
- Current page: 777 of 832
- Download datasheet (13Mb)
6384E–ATARM–05-Feb-10
Shown below is an example of the implementation on the AT91SAM9G20-EK Rev.C.
VDDCORE and VDDBU are controlled by Power-on-Reset (POR) to gurantee that these power
sources reach their target values prior to the release of POR. (See
• VDDIOM and VDDIOP must NOT be powered until VDDCORE has reached a level superior
• VDDIOM and VDDIOP must be ≥ 0.7V within (T2 + T3) after VDDCORE reaches
• VDDIOM and VDDIOP must reach Voh (2.6V) within (T2 +T3 +T4) after VDDCORE has
• T2 = Tres = 30 µs
• T3 = 3 x Tslck
• T4 = 14 x Tslck
or equal to Vth+ (0.5V).
Vth+ (0.5V).
reached Vth+ (0.5V).
REGULATED
FORCE
POWER
ON
5V ONLY
J1
J1
J3
J3
SHDN
1
2
C1
C1
330μF
330μF
Q2
Q2
Si1563EDH
Si1563EDH
5V
C14
C14
15PF
15PF
+
+
6
1
CR1
CR1
5V
5V
R3
R3
100K
100K
5
2
R9
R9
10K
10K
10 SQUARE CM COPPER AREA FOR HEAT SINKING
5V
4
3
R166
R166
10K
10K
R165
R165
15K
15K
MN1
MN1
LT1963AEQ-3.3
LT1963AEQ-3.3
C2
C2
10μF
10μF
10V
10V
2
WITH NO SOLDER MASK
VIN
SD
2
3
1
MMSD4148
MMSD4148
R10
R10
10K
10K
-
-
+
+
GND
GND
6
3
MN15A
MN15A
LM293
LM293
D1
D1
VOUT
1
R167
R167
10K
10K
FB
5
5V
4
3V3 CURRENT MEASURE
C15
C15
4.7μF
4.7μF
C3
C3
10μF
10μF
R169
R169
NOT POPULATED
NOT POPULATED
J2
J2
5V
5
1
R161
R161
R162
R162
15K
15K
C1M
MN3
MN3
C4
C4
10μF
10μF
VIN
EN
82K
82K
8
C5
C5
1μF
1μF
TPS60500
TPS60500
C1P
6
GND
AT91SAM9G20
5
6
Figure
9
C2M
3
+
+
-
-
5V
C6
C6
1μF
1μF
8
4
VOUT
MN15B
MN15B
LM293
LM293
C2P
PG
FB
4
7
41-2.)
7
10
2
C11
C11
22μF
22μF
NOT POPULATED
NOT POPULATED
R163
R163
10K
10K
5V
2
R168
R168
IRLML6402
IRLML6402
C147
C147
100NF
100NF
30K
30K
R7
R7
1V0
R164
R164
1K
1K
R11
R11
120K
120K
10PF
10PF
C12
C12
3
Q3
Q3
3V3
777
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