ST7FOXK1 STMicroelectronics, ST7FOXK1 Datasheet - Page 224

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ST7FOXK1

Manufacturer Part Number
ST7FOXK1
Description
Low cost flash 8bit micro
Manufacturer
STMicroelectronics
Datasheet

Specifications of ST7FOXK1

4 To 8 Kbytes Single Voltage Extended Flash (xflash) Program Memory With Read-out Protection In-circuit Programming And In-application Programming (icp And Iap) Endurance
1K write/erase cycles guaranteed Data retention
Clock Sources
Internal trimmable 8 MHz RC oscillator, auto wakeup internal low power - low frequency oscillator, crystal/ceramic resonator or external clock
Five Power Saving Modes
Halt, Active-Halt, Auto Wakeup from Halt, Wait and Slow
A/d Converter
up to 10 input channels

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Package mechanical data
14.1
224/226
Thermal characteristics
Table 101. Thermal characteristics
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
Symbol
The power dissipation of an application can be defined by the user with the formula: P
where P
ports used in the application.
P
T
R
Dmax
Jmax
thJA
INT
is the chip internal power (I
Package thermal resistance
(junction to ambient)
Power dissipation
Maximum junction
temperature
Ratings
(1)
(2)
DD
xV
DD
) and P
PORT
LQFP32
SDIP32
is the port power dissipation depending on the
DIP20
SO20
D
ST7FOXF1, ST7FOXK1, ST7FOXK2
= (T
J
-T
A
) / R
thJA
.
Value
D
150
160
=P
55
58
76
63
INT
+P
PORT
°C/W
Unit
mW
°C

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