PM5380-BI PMC-Sierra, Inc., PM5380-BI Datasheet - Page 437

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PM5380-BI

Manufacturer Part Number
PM5380-BI
Description
Network Interface, SATURN User Network Interface (8x155) Telecom Standard Product
Manufacturer
PMC-Sierra, Inc.
Datasheet

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Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.
Document No.: PMC- 2010299, Issue 2
20
Part Number
PM5380-BI
Ordering And Thermal Information
Table 40 Ordering Information
This product is designed to operate over a wide temperature range when used with a heat sink
and is suited for outside plant equipment
Table 41 Outside Plant Thermal Information
Maximum long-term operating junction temperature (T
term life.
Maximum junction temperature (T
continued functional performance
local ambient temperature reaches 85 °C.
Minimum ambient temperature (T
Table 42 Device Compact Model
Junction-to-Case Thermal Resistance, q
Junction-to-Board Thermal Resistance, q
Table 43 Heat Sink Requirements
q
Power depends upon the operating mode. To obtain power information, refer to ‘High’ power
values in section 17.
Notes
1.
2.
3.
SA
+q
The minimum ambient temperature requirement for Outside Plant Equipment meets the minimum
ambient temperature requirement for Industrial Equipment
Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core Core; for
more information about this standard, see section 4.
q
junction-to-board thermal resistance, is obtained by simulating conditions described in JEDEC
Standard JESD 51-8; for more information about this standard, see section 4.
CS
JC
, the junction-to-case thermal resistance, is a measured nominal value plus two sigma. q
4
The sum of q
where:
T
location
P
q
SA
A
D
is the ambient temperature at the heat sink
is the operating power dissipated in the package
and q
[(105 - T
CS
are required for long-term operation
SA
+ q
A
) / P
CS
2
A
J
. This condition will typically be reached when the
must be less than or equal to:
)
) for short-term excursions with guaranteed
D
] - q
3
JC
JC
JB
] °C/W
S/UNI®-8x155 ASSP Telecom Standard Product Data Sheet
1
.
[0.2] °C/W
[
6.0
] °C/W
J
Description
520-pin Super Ball Grid Array (SBGA)
) to ensure adequate long-
[105] °C
[125] °C
[-40] °C
JB
Released
, the
437

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