MT28C3212P2 Micron Semiconductor Products, Inc., MT28C3212P2 Datasheet - Page 3

• Manufacturer Part Number: MT28C3212P2
• Description: 2 Meg X 16 Page Flash, 128K X 16 SRAM Combo Memory, 66-ball Fbga
• Manufacturer: Micron Semiconductor Products, Inc.

PART NUMBERING INFORMATION
eral different combinations of features (see Figure 1).
2 Meg x 16 Page Flash 128K x 16 SRAM Combo Memory
MT28C3212P2FL_2.p65 – Rev. 2, Pub. 4/02
Micron’s low-power devices are available with sev-
Density/Organization/Banks
321 = 32Mb (2,048K x 16)
Micron Technology
Flash Family
28C = Dual-Supply Flash/SRAM Combo
SRAM Density
2 = 2Mb SRAM (128K x 16)
Read Mode Operation
P = Asynchronous/Page Read
Operating Voltage Range
2 = 1.65V–1.95V or 1.80V–2.20V
bank a = 1/8; bank b = 7/8
PART NUMBER
MT28C3212P2FL-10 BET
MT28C3212P2FL-10 TET
MT28C3212P2FL-11 BET
MT28C3212P2FL-11 TET
MT28C3212P2NFL-11 TET
Valid Part Number Combinations
MT 28C 321 2 P 2 N FL-11 T ET
Part Number Chart
0.9V–2.2V
0.9V–2.2V
0.0V–2.2V
0.9V–2.2V
0.9V–2.2V
RANGE
V
PP 1
Figure 1
Table 3
128K x 16 SRAM COMBO MEMORY
3
TIME (ns)
ACCESS
Valid combinations of features and their correspond-
ing part numbers are listed in Table 3.
100
110
100
110
110
BOOT BLOCK
Micron Technology, Inc., reserves the right to change products or specifications without notice.
STARTING
ADDRESS
Bottom
Bottom
2 MEG x 16 PAGE FLASH
Top
Top
Top
Boot Block Starting Address
B = Bottom boot
T = Top boot
Access Time
-10 = 100ns
-11 = 110ns
V
None = 0.9V–2.2V
Operating Temperature Range
None = Commercial (0ºC to +70ºC)
Package Code
FL = 66-ball FBGA (8 x 8 grid)
PP1
ET = Extended (-40ºC to +85ºC)
N = 0.0V–2.2V
Range
TEMPERATURE
-40
-40
-40
-40
-40
OPERATING
RANGE
o
o
o
o
o
C to +85
C to +85
C to +85
C to +85
C to +85
o
o
o
o
o
C
C
C
C
C
©2002, Micron Technology, Inc.