ST72F321J ST Microelectronics, ST72F321J Datasheet - Page 168

• Manufacturer Part Number: ST72F321J
• Description: 8-BIT MCU
• Manufacturer: ST Microelectronics

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DataSheet
ST72321J
13.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only as design guidelines.
Figure 107. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 108. Recommended Reflow Soldering Oven Profile (MID JEDEC)
Recommended glue for SMD plastic packages dedicated to molding compound with silicone:
168/179
Heraeus: PD945, PD955
Loctite: 3615, 3298
Temp. [°C]
Temp. [°C]
4
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250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
100
40
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SOLDERING
PHASE
60
5 sec
200
150 sec above 183°C
80
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=235+/-5°C
for 25 sec
300
120
140
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400
160
Time [sec]
Time [sec]
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