mpc8560vt667jb Freescale Semiconductor, Inc, mpc8560vt667jb Datasheet - Page 70

• Manufacturer Part Number: mpc8560vt667jb
• Description: Mpc8560 Powerquicc Iii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1 Package Parameters for the MPC8560 FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
70
Die size
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Solder Balls
Ball diameter (typical)
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
783
1 mm
3.07 mm
3.75 mm
62 Sn/36 Pb/2 Ag
0.5 mm
12.2 mm × 9.5 mm
29 mm × 29 mm
Freescale Semiconductor