mpc8560vt667jb Freescale Semiconductor, Inc, mpc8560vt667jb Datasheet - Page 83

• Manufacturer Part Number: mpc8560vt667jb
• Description: Mpc8560 Powerquicc Iii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

16.2 Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
The system board designer can choose between several types of heat sinks to place on the MPC8560. There
are several commercially-available heat sinks from the following vendors:
Freescale Semiconductor
Junction-to-case thermal
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance
measured on the top surface of the board near the package.
Method 1012.1). Cold plate temperature is used for case temperature; measured value includes the thermal
resistance of the interface layer.
Figure 51. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface Material
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
Table 60. Package Thermal Characteristics (continued)
Characteristic
Adhesive or
Heat Sink
Heat Sink
Figure
Lid
Clip
Die
51. The heat sink should be attached to the printed-circuit
Printed-Circuit Board
FC-PBGA Package
603-224-9988
Symbol
R
θJC
Value
0.8
°C/W
Unit
Notes
4
Thermal
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