mpc8560vt667jb Freescale Semiconductor, Inc, mpc8560vt667jb Datasheet - Page 82

• Manufacturer Part Number: mpc8560vt667jb
• Description: Mpc8560 Powerquicc Iii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

Thermal
15.4 Frequency Options
Table 59
ratio in comparison to the memory bus speed.
16 Thermal
This section describes the thermal specifications of the MPC8560.
16.1 Thermal Characteristics
Table 60
82
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@100 ft/min or 0.5 m/s) on four layer board (2s2p)
Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p)
Junction-to-board thermal
SYSCLK
CCB to
Ratio
10
12
16
2
3
4
5
6
8
9
shows the expected frequency values for the platform frequency when using a CCB to SYSCLK
provides the package thermal characteristics for the MPC8560.
16.67
200
267
Table 59. Frequency Options with Respect to Memory Bus Speeds
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
200
225
250
300
25
Characteristic
Table 60. Package Thermal Characteristics
33.33
200
267
300
333
Platform/CCB Frequency (MHz)
41.63
208
250
333
SYSCLK (MHz)
66.67
200
267
333
250
333
83
Symbol
R
R
R
R
θJMA
θJMA
θJMA
θJB
100
200
300
Value
7.5
16
14
12
Freescale Semiconductor
111
222
333
°C/W
°C/W
°C/W
°C/W
Unit
133.33
Notes
267
1, 2
1, 2
1, 2
3