mpc8560vt667jb Freescale Semiconductor, Inc, mpc8560vt667jb Datasheet - Page 85

• Manufacturer Part Number: mpc8560vt667jb
• Description: Mpc8560 Powerquicc Iii Integrated Communications Processor
• Manufacturer: Freescale Semiconductor, Inc

16.2.2 Internal Package Conduction Resistance
For the packaging technology, shown in
are as follows:
Freescale Semiconductor
•
•
Bump/Underfill—Collapsed resistance
Lid Adhesive—Collapsed resistance
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Conductivity
Substrate and Solder Balls
k
k
k
k
k
k
k
k
k
k
k
k
x
y
z
(10 × 12 × 0.050 mm)
x
y
z
(10 × 12 × 0.070 mm)
x
y
z
x
y
z
(10 × 12 × 0.76 mm)
(29 × 29 × 1.47 mm)
(12 × 14 × 1 mm)
Lid
Die
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
Value
10.2
10.2
360
360
360
0.6
0.6
1.9
1.6
1
1
1
Figure 52. MPC8560 Thermal Model
Table
W/(m × K)
Unit
60, the intrinsic internal conduction thermal resistance paths
y
z
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
Substrate and solder balls
Heat Source
Substrate
Die
Lid
Bump/underfill
Adhesive
Thermal
85