ppc8572elpxavnd Freescale Semiconductor, Inc, ppc8572elpxavnd Datasheet - Page 122

• Manufacturer Part Number: ppc8572elpxavnd
• Description: Mpc8572e Powerquicc Iii Integrated Communications Processors
• Manufacturer: Freescale Semiconductor, Inc

Thermal
19.5.2
Section 4.4.3.6 “I/O Port Selection” of the MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual, describes various high-speed interface configuration options. Note that the
CCB clock frequency must be considered for proper operation of such interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:
See Section 21.1.3.2, “Link Width” of the MPC8572E PowerQUICC™ III Integrated Host Processor
Family Reference Manual, for PCI Express interface width details. Note that the “PCI Express link width”
in the above equation refers to the negotiated link width as the result of PCI Express link training, which
may or may not be the same as the link width POR selection.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
See Section 20.4, “1x/4x LP-Serial Signal Descriptions” of the MPC8572E PowerQUICC™ III Integrated
Host Processor Family Reference Manual, for serial RapidIO interface width and frequency details.
20 Thermal
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.
Table 83
The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
122
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (at 200 ft./min.)
Junction to ambient (ar 200 ft./min.)
Junction to board
shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.
Minimum Platform Frequency Requirements for High-Speed
Interfaces
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Rating
2
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
×
(
0.80
)
×
(
Table 83. Package Thermal Characteristics
serial RapidIO interface frequency
527 MHz
----------------------------------------------------------------------------------------------
×
(
PCI Express link width
Four-layer (2s2p)
Four-layer (2s2p)
Single-layer (1s)
Single-layer (1s)
64
8
Board
—
)
×
(
serial RapidIO link width
)
Symbol
R
R
R
R
R
ΘJMA
ΘJMA
ΘJA
ΘJA
ΘJB
Value
15
11
11
8
4
)
Freescale Semiconductor
°
°
°
°
°
Unit
C/W
C/W
C/W
C/W
C/W
Notes
1, 2
1, 3
1, 3
1, 3
4