saa6712e NXP Semiconductors, saa6712e Datasheet - Page 2
saa6712e
Manufacturer Part Number
saa6712e
Description
Xga Rgb To Tft Graphics Engine
Manufacturer
NXP Semiconductors
Datasheet
1.SAA6712E.pdf
(64 pages)
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Philips Semiconductors
CONTENTS
1
1.1
1.2
1.3
1.4
1.5
1.6
2
3
4
5
6
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.4
7.4.1
7.4.2
7.5
7.5.1
7.5.2
7.6
7.7
7.7.1
7.7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.3.1
8.3.2
8.3.3
1999 Aug 25
XGA RGB to TFT graphics engine
FEATURES
RGB video input
Video processing
On screen display
Video output
Memory interface
Miscellaneous
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
FUNCTIONAL DESCRIPTION
Data path
System clocks
Input interface clock (VCLK)
Memory interface clock (MCLKI)
I
System clock (CLK)
TFT panel clock (PCLK)
RGB input port
TFT output port
Single pixel mode
Double pixel mode
Memory port
SDRAM memory configuration
SGRAM memory configuration
I
Scaling algorithm
Upscaling
Downscaling
SYSTEM DESCRIPTION
Programming registers
Clock management
Clock generation and multiplexing
Clock divider
RGB input interface
RGB data sampling
Clamp pulse generation
Gain correction pulse generation
2
2
C-bus interface clock (SCL)
C-bus interface
2
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.6.1
8.6.2
8.6.3
8.7
8.8
8.8.1
8.8.2
8.8.3
8.8.4
8.9
8.10
8.10.1
8.10.2
8.10.3
8.11
8.12
8.12.1
8.12.2
8.12.3
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
Video mode and synchronization signal
detection
Memory interface
Memory interface limitations
Initialization of external memory
Frame recovery
Scaling
Downscaling
Upscaling
Upscaler transition function
Panning unit
Overlay port
Overlay insertion
Sync generation
Data sampling
OVCLK gating
Colour correction
On screen display
OSD generals
OSD window
OSD character matrix
Temporal dithering (frame rate controller)
Output interface
General
Frame generation
Timing reference signals
LIMITING VALUES
CHARACTERISTICS
TIMING CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
Preliminary specification
2
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