KMPC880ZP66 FREESCALE [Freescale Semiconductor, Inc], KMPC880ZP66 Datasheet - Page 10

• Manufacturer Part Number: KMPC880ZP66
• Description: Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal Characteristics
4 Thermal Characteristics
Table 4
5 Power Dissipation
Table 5
2:1, where CPU frequency is twice bus speed.
10
1
2
3
4
5
6
1
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
Thermal characterization parameter indicating the temperature difference between package top and the junction
Typical power dissipation at V
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
measured on the top surface of the board near the package.
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
temperature per JEDEC JESD51-2.
shows the thermal characteristics for the MPC885/880.
provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are equal, and
Rating
5
4
Die Revision
1
6
0
Table 4. MPC885/880 Thermal Resistance Data
DDL
Natural convection
Airflow (200 ft/min)
Natural convection
Airflow (200 ft/min)
MPC885/MPC880 Hardware Specifications, Rev. 3
= V
DDSYN
Table 5. Power Dissipation (P
= 1.8 V, and V
Environment
Mode
Bus
1:1
2:1
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
DDH
is at 3.3 V.
Frequency
133 MHz
66 MHz
80 MHz
CPU
D
)
Typical
310
350
430
Symbol
R
R
R
R
R
θJMA
R
θJMA
θJMA
Ψ
Ψ
1
θJA
θJC
θJB
JT
JT
2
3
3
3
Maximum
Freescale Semiconductor
390
430
495
Value
37
25
30
22
17
10
2
2
2
°C/W
Unit
Unit
mW
mW
mW