KMPC880ZP66 FREESCALE [Freescale Semiconductor, Inc], KMPC880ZP66 Datasheet - Page 88

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KMPC880ZP66

Manufacturer Part Number
KMPC880ZP66
Description
Hardware Specifications
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Mechanical Data and Ordering Information
16.2 Mechanical Dimensions of the PBGA Package
Figure 77
88
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
NOTES:
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
shows the mechanical dimensions of the PBGA package.
MPC885/MPC880 Hardware Specifications, Rev. 3
Freescale Semiconductor

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