SSTUM32868ET/G NXP [NXP Semiconductors], SSTUM32868ET/G Datasheet - Page 25

• Manufacturer Part Number: SSTUM32868ET/G
• Description: 1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Package outline
Fig 23. Package outline SOT932-1 (TFBGA176)
SSTUM32868_2
Product data sheet
TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT932-1
VERSION
OUTLINE
max
1.15
A
0.35
0.25
A
1
0.80
0.65
A
2
ball A1
index area
ball A1
index area
IEC
- - -
0.45
0.35
b
AB
M
K
H
D
B
Y
V
T
P
F
AA
W
U
R
N
G
C
A
L
J
E
6.1
5.9
D
1
2
e
3
1/2 e
15.1
14.9
4
MO-246
e
D
JEDEC
E
1
5
b
6
7
0.65
REFERENCES
8
e
0
Rev. 02 — 2 March 2007
1/2 e
4.55
B
e
e
1
w
v
1.8 V DDR2-800 configurable registered buffer with parity
e
A
E
13.65
2
JEITA
M
M
e
- - -
2
scale
C
C
5
A
0.15
v
B
A
0.08
w
A
10 mm
2
0.1
y
A
y
1
1
C
detail X
0.1
y
1
PROJECTION
C
EUROPEAN
X
y
SSTUM32868
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
06-01-11
06-01-16
SOT932-1
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