MT29C4G48MAZAPAKD-5 E IT Micron, MT29C4G48MAZAPAKD-5 E IT Datasheet - Page 217

• Manufacturer Part Number: MT29C4G48MAZAPAKD-5 E IT
• Manufacturer: Micron

Revision History
Rev. H, Production – 3/11
Rev. G, Preliminary – 6/10
Rev. F, Preliminary – 3/10
Rev. E, Preliminary – 2/10
Rev. D, Preliminary – 1/10
Rev. C, Preliminary – 12/09
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. H 3/11
• Production status
• Removed Endurance spec from Features and Parameter Page Data Structure Table
• Filled in missing values to READ ID Table
• Changed
• Replaced Status Register Definition table with the correct one for ECC
• Replaced blank with 3 for number of valid address cycles on Block Erase Two-Plane in
• Updated AT Idd tables
• Added reduced page mode
• Changed OTP DATA LOCK BY PAGE to OTP DATA LOCK BY BLOCK in Command Set.
• Updated Status Register Definition .
• Updated OTP section to show OTP protect by BLOCK, rather than by PAGE.
• Added new notes 1 and 2 to DC Characteristics and Operating Conditions (1.8V) and
• Add part number to first page: MT29C4G48MAYAPAKQ-5 IT
• Added "x8" to 168-Ball VFBGA (NAND x8, x16; LPDDR x32) Ball Assignments and x8,
• Added "I/O[15:8] are RFU for x8 NAND devices." for I/O[15:0] description in x8, x16
• Modified Electrical Specifications – IDD Parameters: Changed I
• Removed boot block.
• Updated READ ID Tables to include the following value changes: Byte 1 -
• Added Bare Die Parameter Page Data Structure Table
the Two-Plane Command Set Table
changed Typ value from 20 to 10 and Max value from 40 to 20 for I
x16 NAND Ball Descriptions titles.
NAND Ball Descriptions.
I
MT29F4G08ABBDA (4Gb, x8, 1.8V) Value: ACh, MT29F4G16ABBDA (4Gb, x16, 1.8V)
Value: BCh; Byte 2 - MT29F4G08ABBDA Value: 90h, MT29F4G16ABBDA Value: 90h;
Byte 3 - MT29F4G08ABBDA Value: 15h, MT29F4G16ABBDA Value: 55h; Byte 4 -
MT29F4G08ABBDA Value: 56h, MT29F4G16ABBDA Value: 56h; Removed H4 from
part numbers
DD3PS
, and I
t
BERS from .5 to .7 in Electrical Specifications - Program/Erase Characteristics
DD6
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
values.
217
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
DD2P
Revision History
CC1
, I
, I
DD2PS
CC2
, and I
, I
DD3P
CC3
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