S912XEQ512J3CAGR Freescale Semiconductor, S912XEQ512J3CAGR Datasheet - Page 292

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S912XEQ512J3CAGR

Manufacturer Part Number
S912XEQ512J3CAGR
Description
16-bit Microcontrollers - MCU 16 BIT,512K FLASH
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of S912XEQ512J3CAGR

Rohs
yes
Core
HCS12X
Data Bus Width
16 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
512 kB
Data Ram Size
32 kB
On-chip Adc
Yes
Package / Case
LQFP
Mounting Style
SMD/SMT
Interface Type
CAN/SCI/SPI
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
119
Number Of Timers
25
Program Memory Type
Flash
Supply Voltage - Max
1.98 V, 2.9 V, 5.5 V
Supply Voltage - Min
1.72 V, 2.7 V, 3.13 V

Available stocks

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Part Number:
S912XEQ512J3CAGR
Manufacturer:
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Quantity:
10 000
Chapter 7 Background Debug Module (S12XBDMV2)
16-bit misaligned reads and writes are generally not allowed. If attempted by BDM hardware command,
the BDM will ignore the least significant bit of the address and will assume an even address from the
remaining bits.
For devices with external bus:
The following cycle count information is only valid when the external wait function is not used (see wait
bit of EBI sub-block). During an external wait the BDM can not steal a cycle. Hence be careful with the
external wait function if the BDM serial interface is much faster than the bus, because of the BDM soft-
reset after time-out (see
For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending
the address before attempting to obtain the read data. This is to be certain that valid data is available in the
BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait
150 bus clock cycles after sending the data to be written before attempting to send a new command. This
is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle
delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a
free cycle before stealing a cycle.
For firmware read commands, the external host should wait at least 48 bus clock cycles after sending the
command opcode and before attempting to obtain the read data. This includes the potential of extra cycles
when the access is external and stretched (+1 to maximum +7 cycles) or to registers of the PRU (port
replacement unit) in emulation modes (if modes available). The 48 cycle wait allows enough time for the
requested data to be made available in the BDM shift register, ready to be shifted out.
For firmware write commands, the external host must wait 36 bus clock cycles after sending the data to be
written before attempting to send a new command. This is to avoid disturbing the BDM shift register
before the write has been completed.
The external host should wait at least for 76 bus clock cycles after a TRACE1 or GO command before
starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM
firmware lookup table and resume execution of the user code. Disturbing the BDM shift register
prematurely may adversely affect the exit from the standard BDM firmware lookup table.
Figure 7-7
times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles
in the high state. The time for an 8-bit command is 8 × 16 target clock cycles.
292
represents the BDM command structure. The command blocks illustrate a series of eight bit
This timing has increased from previous BDM modules due to the new
capability in which the BDM serial interface can potentially run faster than
the bus. On previous BDM modules this extra time could be hidden within
the serial time.
If the bus rate of the target processor is unknown or could be changing or the
external wait function is used, it is recommended that the ACK
(acknowledge function) is used to indicate when an operation is complete.
When using ACK, the delay times are automated.
Section 7.4.11, “Serial Communication Time
MC9S12XE-Family Reference Manual Rev. 1.25
NOTE
NOTE
Out”).
1
Freescale Semiconductor

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