S912XEQ512J3CAGR Freescale Semiconductor, S912XEQ512J3CAGR Datasheet - Page 350
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S912XEQ512J3CAGR
Manufacturer Part Number
S912XEQ512J3CAGR
Description
16-bit Microcontrollers - MCU 16 BIT,512K FLASH
Manufacturer
Freescale Semiconductor
Datasheet
1.S912XEQ512J3CAGR.pdf
(1324 pages)
Specifications of S912XEQ512J3CAGR
Rohs
yes
Core
HCS12X
Data Bus Width
16 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
512 kB
Data Ram Size
32 kB
On-chip Adc
Yes
Package / Case
LQFP
Mounting Style
SMD/SMT
Interface Type
CAN/SCI/SPI
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
119
Number Of Timers
25
Program Memory Type
Flash
Supply Voltage - Max
1.98 V, 2.9 V, 5.5 V
Supply Voltage - Min
1.72 V, 2.7 V, 3.13 V
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S912XEQ512J3CAGR
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Chapter 9 Security (S12XE9SECV2)
9.1.4.2
Special single chip mode means BDM is active after reset. The availability of BDM firmware commands
depends on the security state of the device. The BDM secure firmware first performs a blank check of both
the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off
and the state of the security bits in the appropriate Flash memory location can be changed If the blank
check fails, security will remain active, only the BDM hardware commands will be enabled, and the
accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used
to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash
memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed
and the options/security byte can be programmed to “unsecured” state via BDM.
While the BDM is executing the blank check, the BDM interface is completely blocked, which means that
all BDM commands are temporarily blocked.
9.1.4.3
9.1.5
Unsecuring the microcontroller can be done by three different methods:
9.1.5.1
In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key
access method. This method requires that:
350
•
•
•
•
•
•
•
•
•
•
1. Backdoor key access
2. Reprogramming the security bits
3. Complete memory erase (special modes)
•
BDM firmware commands are disabled.
BDM hardware commands are restricted to the register space.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for
details.
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
BDM operation is completely disabled.
Internal Flash memory and EEPROM are disabled.
Execution of Flash and EEPROM commands is restricted. Please refer to the FTM block guide for
details.
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled
The backdoor key at 0xFF00–0xFF07 (= global addresses 0x7F_FF00–0x7F_FF07) has been
programmed to a valid value.
Unsecuring the Microcontroller
Special Single Chip Mode (SS)
Expanded Modes (NX, ES, EX, and ST)
Unsecuring the MCU Using the Backdoor Key Access
MC9S12XE-Family Reference Manual Rev. 1.25
Freescale Semiconductor
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