MCIMX6Q4AVT10ACR Freescale Semiconductor, MCIMX6Q4AVT10ACR Datasheet - Page 113

• Manufacturer Part Number: MCIMX6Q4AVT10ACR
• Description: Processors - Application Specialized i.MX6Q
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX6Q4AVT10ACR

• Core: ARM Cortex A9
• Processor Series: i.MX6
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 1 GHz
• Data Ram Size: 256 KB
• Operating Supply Voltage: 1.05 V to 1.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: FCBGA-624
• Interface Type: I2C, I2S, UART, USB
• Memory Type: L1/L2 Cache, ROM, SRAM
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2

4.11.12.6 High-Speed Clock Timing
4.11.12.7 Forward High-Speed Data Transmission Timing
The timing relationship of the DDR Clock differential signal to the Data differential signal is shown in
Figure
4.11.12.8 Reverse High-Speed Data Transmission Timing
Freescale Semiconductor
L
R
R
S
S
L
Symbol
76:
CLKp
CLKn
NRZ Data
CLKn
CLKp
Equivalent wire bond series inductance
Equivalent wire bond series resistance
Load Resistance
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 2
Figure 77. Reverse High-Speed Data Transmission Timing at Slave Side
Table 74. Electrical and Timing Information (continued)
Parameters
Figure 76. Data to Clock Timing Definitions
1 Data Bit Time = 1UI
Clock to Data
2UI
1 DDR Clock Period = UI
Figure 75. DDR Clock Definition
Skew
UI
INST
(1)
Test Conditions
T
TD
1 Data Bit Time = 1UI
—
—
—
INST
2UI
(1) + UI
UI
INST
INST
(2)
(2)
Min
80
—
—
Typ
100
Electrical Characteristics
—
—
Max
0.15
125
1.5
Unit
nH


113