MA330028 Microchip Technology, MA330028 Datasheet - Page 489

• Manufacturer Part Number: MA330028
• Description: Daughter Cards & OEM Boards dsPIC33EP64MC504 PIM
• Manufacturer: Microchip Technology

Specifications of MA330028

• Rohs: yes
• Product: Daughter Cards
• Core: dsPIC
• Description/function: Plug-in-module with dsPIC33EP64MC504 device for use with DM330021 and DM330023 motor control development board
• Interface Type: CAN, I2C, SPI
• Operating Supply Voltage: 3 to 3.6 V
• Tool Is For Evaluation Of: dsPIC33EP64MC504
• For Use With: DM330021, DM330023

© 2011-2012 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
φ
Units
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70657E-page 489
α
A2