MT9HVF3272KY-667B1 Micron Technology Inc, MT9HVF3272KY-667B1 Datasheet - Page 34

• Manufacturer Part Number: MT9HVF3272KY-667B1
• Description: MODULE DDR2 256MB 244MDIMM VLP
• Manufacturer: Micron Technology Inc

Specifications of MT9HVF3272KY-667B1

• Memory Type: DDR2 SDRAM
• Memory Size: 256MB
• Speed: 667MT/s
• Package / Case: 244-MDIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 244VLP MiniRDIMM
• Device Core Size: 72b
• Organization: 32Mx72
• Total Density: 256MByte
• Chip Density: 256Mb
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.71A
• Number Of Elements: 9
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 55C
• Operating Temperature Classification: Commercial
• Pin Count: 244
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 18:
PDF: 09005aef81c9620b/Source: 09005aef81c961ec
HVF9C32_64_128x72K_2.fm - Rev. B 11/05 EN
Address and control input pulse
width for each input
Address and control input setup
time
Address and control input hold
time
Address and control input setup
time
Address and control input hold
time
CAS# to CAS# command delay
ACTIVE to ACTIVE (same bank)
command
ACTIVE bank a to ACTIVE bank
b command
ACTIVE to READ or WRITE delay
Four Bank Activate period
ACTIVE to PRECHARGE
command
Internal READ to precharge
command delay
Write recovery time
Auto precharge write recovery
+ precharge time
Internal WRITE to READ
command delay
PRECHARGE command period
PRECHARGE ALL command
period
LOAD MODE command cycle
time
CKE low to CK,CK# uncertainty
REFRESH to Active or Refresh to
Refresh command interval
Average periodic refresh
interval
Exit self refresh to non-READ
command
Exit self refresh to READ
command
Exit self refresh timing
reference
Parameter
AC Characteristics
AC Operating Conditions (Sheet 3 of 4)
Notes: 1–5; notes appear on page 36; 0°C ≤ T
256MB, 512MB, 1GB: (x72, SR) 244-Pin DDR2 VLP Reg. MiniDIMM
t
RFC (1GB)
Symbol
(256MB)
(512MB)
t
DELAY
t
t
t
t
t
t
t
t
t
t
t
t
t
t
XSNR
XSRD
t
FAW
t
MRD
t
t
t
t
WTR
ISXR
CCD
RRD
RCD
DAL
REFI
IPW
t
t
t
RAS
t
RPA
RTP
RFC
RFC
WR
IH
IH
IS
IS
RC
RP
a
b
b
a
t
RP +
(MIN) +
t
127.5
WR +
t
Min
37.5
400
400
200
275
105
200
0.6
7.5
7.5
t
t
RFC
55
15
40
10
15
75
10
15
t
RP
IS +
2
2
IS
t
CK
-667
t
CK +
CASE
70,000
70,000
70,000
70,000
Max
34
7.8
t
IH
≤ +85°C; V
t
RP +
(MIN) +
t
127.5
WR +
Min
t
37.5
500
500
250
375
105
200
t
t
0.6
7.5
7.5
7.5
RFC
Micron Technology, Inc., reserves the right to change products or specifications without notice.
55
15
40
15
15
75
10
t
RP
IS +
2
2
IS
t
DD
CK
-53E
t
CK +
Q = +1.8V ±0.1V, V
70,000
70,000
70,000
70,000
Max
7.8
t
IH
AC Operating Specifications
t
RP +
(MIN) +
t
127.5
WR +
Min
37.5
t
600
600
350
475
105
200
t
t
0.6
7.5
7.5
RFC
55
15
40
15
10
15
75
10
t
RP
IS +
2
2
IS
©2004, 2005 Micron Technology, Inc. All rights reserved.
t
CK
-40E
t
DD
CK +
70,000
70,000
70,000
70,000
= +1.8V ±0.1V
Max
7.8
t
IH
Units
t
t
t
t
ps
ps
ps
ps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
ns
ps
CK
CK
CK
CK
Notes
21, 34
24, 28
6, 22
6, 22
6, 22
6, 22
6, 30
34
28
31
28
23
28
32
32
29
14
14
14
14