STEVAL-ISQ002V1 STMicroelectronics, STEVAL-ISQ002V1 Datasheet - Page 160
![BOARD EVAL BASED ON ST72264G1](/photos/9/9/90917/steval-isq002v1_sml.jpg)
STEVAL-ISQ002V1
Manufacturer Part Number
STEVAL-ISQ002V1
Description
BOARD EVAL BASED ON ST72264G1
Manufacturer
STMicroelectronics
Specifications of STEVAL-ISQ002V1
Main Purpose
Interface, PMBus
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
ST72F264
Primary Attributes
The PMBus™ Interface Using the ST7 I2C Peripheral
Secondary Attributes
Firmware in C Language
Product
Power Management Modules
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-6423
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STEVAL-ISQ002V1
Manufacturer:
STMicroelectronics
Quantity:
1
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ST72260Gx, ST72262Gx, ST72264Gx
Figure 104. Low Profile Fine Pitch Ball Grid Array Package
14.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
and P
2. The average chip-junction temperature can be obtained from the formula T
160/172
PORT
Symbol
T
R
Jmax
P
is the port power dissipation determined by the user.
thJA
D
SEATING
PLANE
C
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
A1 CORNER INDEX AREA
(SEE NOTE 3)
e
BOTTOM VIEW
D1
D
1)
LFBGA 6x6 (on single-layer PCB)
LFBGA 6x6 (on multilayer PCB)
Ratings
f
∅b (36 BALLS)
D
=P
2)
INT
+P
PORT
where P
SDIP32
SO28
J
= T
INT
Dim
ddd
A1 0.270
A2
D1
E1
A
D
b
E
e
f
A
is the chip internal power (I
+ P
1.210
0.450 0.500 0.550 0.018 0.020 0.022
5.750 6.000 6.150 0.226 0.236 0.242
5.750 6.000 6.150 0.226 0.236 0.242
0.720 0.800 0.880 0.028 0.031 0.035
0.850 1.000 1.150 0.033 0.039 0.045
Min
D
x RthJA.
1.120
4.000
4.000
mm
Typ Max Min
Value
150
500
60
75
56
72
1.700 0.048
0.120
0.011
inches
0.044
0.157
0.157
Typ Max
°C/W
DD
Unit
mW
°C
0.067
0.005
xV
DD
)
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