C8051F996DK Silicon Laboratories Inc, C8051F996DK Datasheet - Page 43
C8051F996DK
Manufacturer Part Number
C8051F996DK
Description
KIT DEV FOR C8051F996
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Datasheets
1.C8051F996DK.pdf
(24 pages)
2.C8051F996DK.pdf
(2 pages)
3.C8051F996DK.pdf
(4 pages)
4.C8051F996DK.pdf
(322 pages)
Specifications of C8051F996DK
Contents
Board, Batteries, Cables, CDs, Debug Adapter, Documentation, Power Adapter
Processor To Be Evaluated
C8051F996
Processor Series
C8051F98x
Interface Type
USB
Operating Supply Voltage
3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051F996
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1963
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all
4. A 2x2 array of 1.10 mm x 1.10 mm openings on 1.30 mm pitch should be
1. A No-Clean, Type-3 solder paste is recommended.
1. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for Small Body Components.
Dimension
C1
C2
X1
X2
Y1
Y2
E
Table 3.5. PCB Land Pattern
Rev. 1.0
3.90
3.90
0.20
2.70
0.65
2.70
MIN
C8051F99x-C8051F98x
0.50 BSC
MAX
4.00
4.00
0.30
2.80
0.75
2.80
43
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