C8051F560-TB Silicon Laboratories Inc, C8051F560-TB Datasheet - Page 4

• Manufacturer Part Number: C8051F560-TB
• Description: BOARD PROTOTYPE W/C8051F560
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F560-TB

• Contents: Board
• Processor To Be Evaluated: C8051F56x
• Processor Series: C8051F56x
• Interface Type: USB
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.8 V to 5.25 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F55x, C8051F56x, C8051F57x
• For Use With: 336-1691 - KIT DEVELOPMENT FOR C8051F560
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1694

C8051F55x/56x/57x
13. Interrupts .............................................................................................................. 112
14. Flash Memory....................................................................................................... 124
15. Power Management Modes................................................................................. 133
16. Reset Sources ...................................................................................................... 136
17. External Data Memory Interface and On-Chip XRAM ....................................... 142
4
12.2. Interrupts and SFR Paging .............................................................................. 95
12.3. SFR Page Stack Example ............................................................................... 97
13.1. MCU Interrupt Sources and Vectors.............................................................. 112
13.2. Interrupt Register Descriptions ...................................................................... 115
13.3. External Interrupts INT0 and INT1................................................................. 122
14.1. Programming The Flash Memory .................................................................. 124
14.2. Non-volatile Data Storage ............................................................................. 126
14.3. Security Options ............................................................................................ 126
14.4. Flash Write and Erase Guidelines ................................................................. 128
15.1. Idle Mode....................................................................................................... 133
15.2. Stop Mode ..................................................................................................... 134
15.3. Suspend Mode .............................................................................................. 134
16.1. Power-On Reset ............................................................................................ 137
16.2. Power-Fail Reset/VDD Monitor ..................................................................... 137
16.3. External Reset ............................................................................................... 139
16.4. Missing Clock Detector Reset ....................................................................... 139
16.5. Comparator0 Reset ....................................................................................... 140
16.6. PCA Watchdog Timer Reset ......................................................................... 140
16.7. Flash Error Reset .......................................................................................... 140
16.8. Software Reset .............................................................................................. 140
17.1. Accessing XRAM........................................................................................... 142
17.2. Configuring the External Memory Interface ................................................... 143
17.3. Port Configuration.......................................................................................... 143
17.4. Multiplexed Mode .......................................................................................... 147
17.5. Memory Mode Selection................................................................................ 148
13.1.1. Interrupt Priorities.................................................................................. 113
13.1.2. Interrupt Latency ................................................................................... 113
14.1.1. Flash Lock and Key Functions .............................................................. 124
14.1.2. Flash Erase Procedure ......................................................................... 124
14.1.3. Flash Write Procedure .......................................................................... 125
14.1.4. Flash Write Optimization ....................................................................... 125
14.4.1. V
14.4.2. PSWE Maintenance .............................................................................. 128
14.4.3. System Clock ........................................................................................ 129
17.1.1. 16-Bit MOVX Example .......................................................................... 142
17.1.2. 8-Bit MOVX Example ............................................................................ 142
17.5.1. Internal XRAM Only .............................................................................. 148
17.5.2. Split Mode without Bank Select............................................................. 148
17.5.3. Split Mode with Bank Select.................................................................. 149
17.5.4. External Only......................................................................................... 149
DD
Maintenance and the V
Rev. 1.1
DD
monitor ................................................ 128