LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 6

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
4. Applications
5. Ordering options
Table 3.
Table 4.
Table 5.
UM10237_4
User manual
Type number
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Type number
LPC2458FET180
Type number
LPC2420FBD208 LQFP208
LPC2460FBD208 LQFP208
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
LPC2458 ordering information
LPC2458 ordering options
LPC2420/60 ordering information
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Package
Name
Package
Name
Flash
(kB)
512
•
•
•
•
•
•
Boundary scan for simplified board testing.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
Industrial control
Medical systems
Protocol converter
Communications
64 16 16 2
Description
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SRAM (kB)
98 16-bit
Rev. 04 — 26 August 2009
External
bus
Ethernet
MII/
RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
2
SD/
MMC
yes
GP
DMA
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
1
Version
Version
SOT459-1
SOT459-1
Temp
range
−40 °C to
+85 °C
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