LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 693

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
UM10237_4
User manual
10.2 Copy RAM to Flash
Table 621. IAP Prepare sector(s) for write operation command
Table 622. IAP Copy RAM to Flash command
Command
Input
Return Code
Result
Description
Command
Input
Return Code
Result
Description
Prepare sector(s) for write operation
Command code: 50
Param0: Start Sector Number
Param1: End Sector Number (should be greater than or equal to start sector
number).
CMD_SUCCESS |
BUSY |
INVALID_SECTOR
None
This command must be executed before executing "Copy RAM to Flash" or
"Erase Sector(s)" command. Successful execution of the "Copy RAM to Flash" or
"Erase Sector(s)" command causes relevant sectors to be protected again. The
boot sector can not be prepared by this command. To prepare a single sector use
the same "Start" and "End" sector numbers.
Copy RAM to Flash
Command code: 51
Param0(DST): Destination Flash address where data bytes are to be written. This
address should be a 256 byte boundary.
Param1(SRC): Source RAM address from which data bytes are to be read. This
address should be a word boundary.
Param2: Number of bytes to be written. Should be 256 | 512 | 1024 | 4096.
Param3: System Clock Frequency (CCLK) in kHz.
CMD_SUCCESS |
SRC_ADDR_ERROR (Address not a word boundary) |
DST_ADDR_ERROR (Address not on correct boundary) |
SRC_ADDR_NOT_MAPPED |
DST_ADDR_NOT_MAPPED |
COUNT_ERROR (Byte count is not 256 | 512 | 1024 | 4096) |
SECTOR_NOT_PREPARED_FOR_WRITE_OPERATION |
BUSY |
None
This command is used to program the Flash memory. The affected sectors should
be prepared first by calling "Prepare Sector for Write Operation" command. The
affected sectors are automatically protected again once the copy command is
successfully executed. The boot sector can not be written by this command.
Rev. 04 — 26 August 2009
Chapter 30: LPC24XX Flash memory programming firmware
10
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UM10237
© NXP B.V. 2009. All rights reserved.
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