LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 741
LPC2478FBD208,551
Manufacturer Part Number
LPC2478FBD208,551
Description
IC ARM7 MCU 512K LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(91 pages)
2.OM11077.pdf
(792 pages)
3.OM11077.pdf
(10 pages)
4.LPC2478FBD208551.pdf
(89 pages)
Specifications of LPC2478FBD208,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4363
935284069551
LPC2478FBD208-S
935284069551
LPC2478FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
- OM11077 PDF datasheet
- OM11077 PDF datasheet #2
- OM11077 PDF datasheet #3
- LPC2478FBD208551 PDF datasheet #4
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NXP Semiconductors
4. Pin description
UM10237_4
User manual
The ARM7TDMI-S core has a Debug Communication Channel function in-built. The
debug communication channel allows a program running on the target to communicate
with the host debugger or another separate host without stopping the program flow or
even entering the debug state. The debug communication channel is accessed as a
co-processor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
Table 677. EmbeddedICE pin description
[1]
[2]
Pin Name
DBGEN
TMS
TCK
TDI
TDO
nTRST
RTCK
•
•
[1]
trigger on an access to a peripheral and the second to trigger on the code segment
that performs the task switching. Therefore when the breakpoints trigger the
information regarding which task has switched out will be ready for examination.
The watchpoints can be configured such that a range of addresses are enabled for
the watchpoints to be active. The RANGE function allows the breakpoints to be
combined such that a breakpoint is to occur if an access occurs in the bottom
256 bytes of memory but not in the bottom 32 bytes.
For more details refer to IEEE Standard 1149.1 - 1990 Standard Test Access Port and
Boundary Scan Architecture.
This pin has a built-in pull-up resistor.
This pin has no built-in pull-up and no built-in pull-down resistor.
[2]
[1]
[2]
[1]
[1]
[1]
Type
Input
Input
Input
Input
Output
Input
Output
Rev. 04 — 26 August 2009
Description
Debug Enable . JTAG interface control signal (see
Test Mode Select. The TMS pin selects the next state in the TAP state
machine.
Test Clock. This allows shifting of the data in, on the TMS and TDI pins. It
is a positive edgetriggered clock with the TMS and TCK signals that
define the internal state of the device.
Remark: This clock must be slower than 1 ⁄ 6 of the CPU clock (CCLK) for
the JTAG interface to operate.
Test Data In. This is the serial data input for the shift register.
Test Data Output. This is the serial data output from the shift register.
Data is shifted out of the device on the negative edge of the TCK signal.
Test Reset. The nTRST pin can be used to reset the test logic within the
EmbeddedICE logic.
Returned Test Clock. Extra signal added to the JTAG port. Required for
designs based on ARM7TDMI-S processor core. Multi-ICE (Development
system from ARM) uses this signal to maintain synchronization with
targets having slow or widely varying clock frequency. For details refer to
"Multi-ICE System Design considerations Application Note 72 (ARM DAI
0072A)" .
Board designers may need to connect a weak bias resistor to this pin as
described below.
Chapter 33: LPC24XX EmbeddedICE
Section
UM10237
© NXP B.V. 2009. All rights reserved.
33–5).
741 of 792
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