DF2166VT33V Renesas Electronics America, DF2166VT33V Datasheet - Page 649

IC H8S MCU FLASH 512K 144TQFP

DF2166VT33V

Manufacturer Part Number
DF2166VT33V
Description
IC H8S MCU FLASH 512K 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheets

Specifications of DF2166VT33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Package
144TQFP
Family Name
H8S
Maximum Speed
33 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16|32 Bit
Number Of Programmable I/os
106
Number Of Timers
5
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
DF2166VTE33V
DF2166VTE33V
HD64F2166VTE33V
HD64F2166VTE33V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2166VT33V
Manufacturer:
Exar
Quantity:
60
Part Number:
DF2166VT33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
18.7.3
If conditions shown below are not met, the reliability of this LSI may be adversely affected.
• Relation between AVCC, AVSS and VCC, VSS
• AVref pin reference voltage specification range
18.7.4
In board design, digital circuitry and analog circuitry should be as mutually isolated as possible,
and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close
proximity should be avoided as far as possible. Failure to do so may result in incorrect operation
of the analog circuitry due to inductance, adversely affecting A/D conversion values. Also, digital
circuitry must be isolated from the analog input signals (AN0 to AN7), and analog power supply
(AVCC) by the analog ground (AVSS). Also, the analog ground (AVSS) should be connected at
one point to a stable digital ground (VSS) on the board.
18.7.5
A protection circuit connected to prevent damage due to an abnormal voltage such as an excessive
surge at the analog input pins (AN0 to AN7) should be connected between AVCC and AVSS as
shown in figure 18.7. Also, the bypass capacitors connected to AVCC and AVref, and the filter
capacitors connected to AN0 to AN7 must be connected to AVSS.
If a filter capacitor is connected, the input currents at the analog input pins (AN0 to AN7) are
averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in
scan mode, if the current charged and discharged by the capacitance of the sample-and-hold circuit
in the A/D converter exceeds the current input via the input impedance (R
the analog input pin voltage. Careful consideration is therefore required when deciding the circuit
constants.
The voltage applied to analog input pin ANn during A/D conversion should be in the range
AVSS ≤ ANn ≤ AVref (n = 0 to 7).
For the relationship between AVCC, AVSS and VCC, VSS, set AVSS = VSS, and AVCC =
VCC is not always necessary. If the A/D converter is not used, the AVCC and AVSS pins
must on no account be left open.
The reference voltage of the AVref pin should be in the range AVref ≤ AVCC.
Analog input voltage range
Setting Range of Analog Power Supply and Other Pins
Notes on Board Design
Notes on Noise Countermeasures
Rev. 3.00, 03/04, page 607 of 830
in
), an error will arise in

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