AT32UC3B0256-Z2UT Atmel, AT32UC3B0256-Z2UT Datasheet - Page 603

IC MCU AVR32 256KB FLASH 64-QFN

AT32UC3B0256-Z2UT

Manufacturer Part Number
AT32UC3B0256-Z2UT
Description
IC MCU AVR32 256KB FLASH 64-QFN
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheets

Specifications of AT32UC3B0256-Z2UT

Core Processor
AVR
Core Size
32-Bit
Speed
60MHz
Connectivity
I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
44
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-QFN
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
44
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1101
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Package
64QFN EP
Device Core
AVR32
Family Name
AT32
Maximum Speed
60 MHz
Operating Supply Voltage
1.8|3.3 V
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATSTK600-TQFP64-2 - STK600 SOCKET/ADAPTER FOR 64-TQFATEVK1101 - KIT DEV/EVAL FOR AVR32 AT32UC3B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3B0256-Z2UT
Manufacturer:
ATMEL
Quantity:
444
27.5.2.3
32059K–03/2011
EXTEST
Table 27-11. SAMPLE_PRELOAD Details
This instruction selects the boundary-scan chain as Data Register for testing circuitry external to
the 32-bit AVR package. The contents of the latched outputs of the boundary-scan chain is
driven out as soon as the JTAG IR-register is loaded with the EXTEST instruction.
Starting in Run-Test/Idle, the EXTEST instruction is accessed the following way:
Table 27-12. EXTEST Details
Instructions
IR input value
IR output value
DR Size
DR input value
DR output value
Instructions
IR input value
IR output value
DR Size
DR input value
DR output value
1. Select the IR Scan path.
2. In Capture-IR: The IR output value is latched into the shift register.
3. In Shift-IR: The instruction register is shifted by the TCK input.
4. Return to Run-Test/Idle.
5. Select the DR Scan path.
6. In Capture-DR: The Data on the external pins are sampled into the boundary-scan
7. In Shift-DR: The boundary-scan chain is shifted by the TCK input.
8. Return to Run-Test/Idle.
1. Select the IR Scan path.
2. In Capture-IR: The IR output value is latched into the shift register.
3. In Shift-IR: The instruction register is shifted by the TCK input.
4. In Update-IR: The data from the boundary-scan chain is applied to the output pins.
5. Return to Run-Test/Idle.
6. Select the DR Scan path.
7. In Capture-DR: The data on the external pins is sampled into the boundary-scan chain.
8. In Shift-DR: The boundary-scan chain is shifted by the TCK input.
9. In Update-DR: The data from the scan chain is applied to the output pins.
10. Return to Run-Test/Idle.
chain.
Details
00010 (0x02)
p0001
Depending on boundary-scan chain, see BSDL-file.
Depending on boundary-scan chain, see BSDL-file.
Depending on boundary-scan chain, see BSDL-file.
Details
00011 (0x03)
p0001
Depending on boundary-scan chain, see BSDL-file.
Depending on boundary-scan chain, see BSDL-file.
Depending on boundary-scan chain, see BSDL-file.
AT32UC3B
603

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