ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 131

MCU AVR 256KB FLASH A3B 64-QFN

ATXMEGA256A3B-MH

Manufacturer Part Number
ATXMEGA256A3B-MH
Description
MCU AVR 256KB FLASH A3B 64-QFN
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheets

Specifications of ATXMEGA256A3B-MH

Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
49
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATXMEGA256x
Core
AVR8
Data Bus Width
8 bit, 16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
49
Number Of Timers
7
Operating Supply Voltage
1.6 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATXMEGA256A3B-MU
ATXMEGA256A3B-MU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATXMEGA256A3B-MH
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
13.4
13.4.1
13.4.1.1
8077H–AVR–12/09
I/O Pin Configuration
Totem-pole
Totem-pole with Pull-down
The Pin n Configuration (PINnCTRL) register is used for additional I/O pin configuration. A pin
can be set in a totem-pole, wired-AND, or wired-OR configuration. It is also possible to enable
inverted input and output for the pin.
For totem-pole output there are four possible pull configurations: Totem-pole (Push-pull), Pull-
down, Pull-up and Bus-keeper. The bus-keeper is active in both directions. This is to avoid oscil-
lation when disabling the output. The totem-pole configurations with pull-up and pull-down only
have active resistors when the pin is set as input. This feature eliminates unnecessary power
consumption. For wired-AND and wired-OR configuration, the optional pull-up and pull-down
resistors are active in both input and output direction.
Since pull configuration is configured through the pin configuration register, all intermediate port
states during switching of pin direction and pin values are avoided.
The I/O pin configurations are summarized with simplified schematics from
131
When configured for Totem-pole (push-pull), the pin is driven low or high according to the corre-
sponding bit setting in OUT. In this configuration there is no current limitation for sink or source
other than what the pin is capable of. If the pin is configured for input, the pin will float if no exter-
nal pull is connected.
Figure 13-2. I/O pin configuration - Totem-pole (push-pull)
In this mode, the configuration is as for Totem-pole, expect the pin is configured with internal
pull-down when set as input.
Figure 13-3. I/O pin configuration - Totem-pole with pull-down (on input)
to
Figure 13-7 on page
OUTn
DIRn
133.
INn
OUTn
DIRn
INn
Pn
Figure 13-2 on page
XMEGA A
Pn
131

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