ST7FDALIF2M6TR STMicroelectronics, ST7FDALIF2M6TR Datasheet - Page 141

• Manufacturer Part Number: ST7FDALIF2M6TR
• Description: IC MCU 8BIT 8K FLASH 20-SOIC
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FDALIF2M6TR

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: DALI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Processor Series: ST7DALI
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: DALI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7FLITE-SK/RAIS, ST7DALI-EVAL, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 7 Channel / 13 bit, 7 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ST7DALIF2
20.7
20.7.1
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
■
■
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
●
●
●
Prequalification trials:
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 81.
Symbol
V
V
FESD
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with
the IEC 1000-4-4 standard.
FFTB
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
to induce a functional disturbance
EMS data
Parameter
DD
and V
DD
pins
V
conforms to IEC 1000-4-2
V
conforms to IEC 1000-4-4
DD
DD
=5 V, T
=5 V, T
A
A
Conditions
=+25°C, f
=+25°C, f
Electrical characteristics
OSC2
OSC2
=8 MHz
=8 MHz
DD
and V
141/171
Level/
class
3B
3B
SS