MC9S12XA512CAG Freescale Semiconductor, MC9S12XA512CAG Datasheet - Page 1186
![IC MCU 512K FLASH 144-LQFP](/photos/12/38/123875/mc9s12xa512cag_sml.jpg)
MC9S12XA512CAG
Manufacturer Part Number
MC9S12XA512CAG
Description
IC MCU 512K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Specifications of MC9S12XA512CAG
Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XA
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
119
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 24 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XA512CAG
Manufacturer:
Freescale
Quantity:
490
Company:
Part Number:
MC9S12XA512CAG
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Chapter 28 256 Kbyte Flash Module (S12XFTX256K2V1)
unaffected by the backdoor key access sequence. After the next reset of the MCU, the security state of the
Flash module is determined by the Flash security byte (0x7F_FF0F). The backdoor key access sequence
has no effect on the program and erase protections defined in the Flash protection register.
It is not possible to unsecure the MCU in special single chip mode by using the backdoor key access
sequence in background debug mode (BDM).
28.6.2
The MCU can be unsecured in special single chip mode by erasing the Flash module by the following
method:
After the CCIF flag sets to indicate that the mass operation has completed, reset the MCU into special
single chip mode. The BDM secure ROM will verify that the Flash memory is erased and will assert the
UNSEC bit in the BDM status register. This BDM action will cause the MCU to override the Flash security
state and the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte
may be programmed to the unsecure state by the following method:
28.7
28.7.1
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
registers from the Flash memory according to
28.7.2
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
28.8
The Flash module can generate an interrupt when all Flash command operations have completed, when the
Flash address, data and command buffers are empty.
1188
•
•
•
•
•
Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM
secure ROM, send BDM commands to disable protection in the Flash module, and execute a mass
erase command write sequence to erase the Flash memory.
Send BDM commands to execute a word program sequence to program the Flash security byte to
the unsecured state and reset the MCU.
FPROT — Flash Protection Register (see
FCTL - Flash Control Register (see
FSEC — Flash Security Register (see
Resets
Interrupts
Unsecuring the MCU in Special Single Chip Mode using BDM
Flash Reset Sequence
Reset While Flash Command Active
MC9S12XDP512 Data Sheet, Rev. 2.21
Section
Section
Table
Section
28.3.2.8).
28-1:
28.3.2.2).
28.3.2.5).
Freescale Semiconductor
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