MC9S12XDT256MAG Freescale Semiconductor, MC9S12XDT256MAG Datasheet - Page 1243

• Manufacturer Part Number: MC9S12XDT256MAG
• Description: IC MCU 256K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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5
6
7
Freescale Semiconductor
Num
10
11
12
13
14
15
The values for thermal resistance are achieved by package simulations
Junction to ambient thermal resistance,
horizontal configuration in natural convection.
Maskset L15Y / M84E in LQFP112 or QFP80
Maskset M42E in LQFP112 or QFP80
Junction to ambient thermal resistance,
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
Thermal characterization parameter
case as defined in JESD51-2.
enviroment.
1
2
3
4
5
6
7
8
9
C
T
T
T
T
T
T
T
T
T
Thermal resistance LQFP144, single sided PCB
Thermal resistance LQFP144, double sided PCB
with 2 internal planes
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance LQFP112, single sided PCB
Thermal resistance LQFP112, double sided PCB
with 2 internal planes
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
3
5
3
JT
Table A-5. Thermal Package Characteristics
is a useful value to use to estimate junction temperature in a steady state customer
Rating
6
4
JT
4
is the “resistance” from junction to reference point thermocouple on top center of the
MC9S12XDP512 Data Sheet, Rev. 2.21
JA
JA
7
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
LQFP144
LQFP112
2
QFP80
2
2
Symbol
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Appendix A Electrical Characteristics
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
43
32
22
45
33
19
11
7
Max
3
7/4
3
3/2
3
3
3
3
3
3
41
32
22
/11
3
/49
3
/39
/27
/49
/36
/20
/14
4
4
4
4
4
4
4
4
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
1245