MC9S12XDT256MAG Freescale Semiconductor, MC9S12XDT256MAG Datasheet - Page 730

• Manufacturer Part Number: MC9S12XDT256MAG
• Description: IC MCU 256K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 19 S12X Debug (S12XDBGV2) Module
When program control returns from a tagged breakpoint using an RTI or BDM GO command without
program counter modification it will return to the instruction whose tag generated the breakpoint. Thus
care must be taken to avoid re triggering a breakpoint at the same location. This can be done by
reconfiguring the DBG module in the SWI routine, (SWI configuration), or by executing a TRACE
command before the GO (BDM configuration) to increment the program flow past the tagged instruction.
Comparators should not be configured for the vector address range while tagging, since these addresses
are not opcode addresses
MC9S12XDP512 Data Sheet, Rev. 2.21
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