LFXP2-8E-5FTN256I Lattice, LFXP2-8E-5FTN256I Datasheet - Page 330

FPGA - Field Programmable Gate Array 8K LUTs 201 I/O Inst on DSP 1.2V -5 Spd

LFXP2-8E-5FTN256I

Manufacturer Part Number
LFXP2-8E-5FTN256I
Description
FPGA - Field Programmable Gate Array 8K LUTs 201 I/O Inst on DSP 1.2V -5 Spd
Manufacturer
Lattice
Datasheet

Specifications of LFXP2-8E-5FTN256I

Number Of Macrocells
8000
Number Of Programmable I/os
201
Data Ram Size
226304
Supply Voltage (max)
1.26 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.14 V
Package / Case
FTBGA-256
Number Of Logic Elements/cells
*
Number Of Labs/clbs
*
Total Ram Bits
226304
Number Of I /o
201
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
*
Operating Temperature
-40°C ~ 100°C
Package
256FTBGA
Family Name
LatticeXP2
Device Logic Units
8000
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
201
Ram Bits
226304
Re-programmability Support
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP2-8E-5FTN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
Part 2: Program the Primary Pattern into LatticeXP2 Embedded Flash
Follow the procedures shown in Figure 17-3 and Table 17-5 too program the JEDEC file into the LatticeXP2
embedded Flash using the ispVM System. There is absolutely no difference between programming the LatticeXP2
device for standard single boot and dual boot applications.
For live field upgrade of a mission critical application, Background Mode programming is strongly recommended.
For more details on Background Mode programming mode for mission critical application, please refer to the
LatticeXP2 Mission Critical Field Upgrade Usage Guide. Contact Lattice Applications for the document if required.
Once the embedded Flash and Done fuse is programmed, it can be difficult to configure the LatticeXP2 device from
the external SPI Flash device. There are two methods that can be used to test the dual boot feature does work.
Figure 17-3. Using ispVM to Program a JEDEC into the Embedded Flash
1. Drive the CFG1 pin to 0. This will cause the bitstream in the SPI Flash to be the Primary pattern.
2. Use the ERASE_DONE command to erase only the Done fuse of the LatticeXP2 Embedded Flash. The
only draw back of this approach is that entire LatticeXP2 Embedded Flash will need to be re-programmed.
Simply programming the Done fuse will not work.
6
6 6
2
2 2
3
3 3
4
4 4
1
1 1
17-12
7
7 7
5
5 5
Operation List of Interest
Operation List of Interest
FLASH Erase,Program,Verify,Secure
FLASH Erase,Program,Verify,Secure
FLASH Erase,Program,Verify,Secure
FLASH Erase,Program,Verify,Refresh
FLASH Erase,Program,Verify,Refresh
FLASH Erase,Program,Verify,Refresh
FLASH Verify Only
FLASH Verify Only
FLASH Verify Only
FLASH Erase Only
FLASH Erase Only
FLASH Erase Only
FLASH Read Status Register
FLASH Read Status Register
FLASH Read Status Register
FLASH Read DONE bit
FLASH Read DONE bit
FLASH Read DONE bit
FLASH Refresh
FLASH Refresh
FLASH Refresh
FLASH Erase,Program,Verify
FLASH Erase,Program,Verify
FLASH Erase,Program,Verify
LatticeXP2 Dual Boot Feature

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