ADSP-BF535PBBZ-200 Analog Devices Inc, ADSP-BF535PBBZ-200 Datasheet - Page 44

• Manufacturer Part Number: ADSP-BF535PBBZ-200
• Description: 200/400MMAC 16-bit DSP MICROCOMPUTER
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF535PBBZ-200

• Interface: PCI, SPI, SSP, UART, USB
• Clock Rate: 200MHz
• Non-volatile Memory: External
• On-chip Ram: 308kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.50V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 260-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF535
Revision History
Part Number
ADSP-BF535PKB-350
ADSP-BF535PKB-300
ADSP-BF535PBB-300
ADSP-BF535PBB-200
Location
9/04—Data Sheet Changed from REV. 0 to REV. A
Changes to Clock Signals Section ........................................................................................................................ 13
Changes to Recommended Operating Conditions Footnote References ................................................................. 21
Changes to Electrical Characteristics ................................................................................................................... 21
Change to Table 11 ............................................................................................................................................ 24
Change to Figure 11 ............................................................................................................................................ 27
Change to Figure 12 ........................................................................................................................................... 28
Change to Output Drive Currents Section ............................................................................................................ 36
Replaced Figures 19, 20, and 21 .......................................................................................................................... 36
Changes to Power Dissipation Section ................................................................................................................. 36
Change to Table 26 ............................................................................................................................................ 36
2.50
MAX
NOTES
1.
2. THE ACTUAL POSITION OF THE BALL GRID
3. THE ACTUAL POSITION OF EACH BALL IS
4. CENTER DIMENSIONS ARE NOMINAL.
5. COMPLIANT TO JEDEC REGISTERED OUTLINE
ALL DIMENSIONS ARE IN MILLIMETERS.
IS WITHIN 0.25 MM OF ITS IDEAL POSITION
RELATIVE TO THE PACKAGE EDGES.
WITHIN 0.10 MM OF ITS IDEAL POSITION RELATIVE
TO THE BALL GRID.
MS-034, VARIATION AAG-1.
Figure 27. 260-Ball Metric Plastic Ball Grid Array (PBGA) (B-260)
Temperature Range (Ambient)
0ºC to +70ºC
0ºC to +70ºC
–40ºC to +85ºC
–40ºC to +85ºC
19.00 BSC SQ
BALL A1
INDICATOR
TOP VIEW
OUTLINE DIMENSIONS
ORDERING GUIDE
17.05
16.95 SQ
16.85
DETAIL A
–44–
1.00
BSC
Instruction Rate
350 MHz
300 MHz
300 MHz
200 MHz
0.65
0.45
0.40
MIN
17.00
BSC
SQ
BALL DIAMETER
18
17
16 14 12 10 8
0.70
0.60
0.50
15 13 11 9
DETAIL A
BOTTOM VIEW
1.00 BSC
BALL PITCH
Operating Voltage (V)
1.0 V to 1.6 V internal, 3.3 V I/O
1.0 V to 1.5 V internal, 3.3 V I/O
1.0 V to 1.5 V internal, 3.3 V I/O
1.0 V to 1.5 V internal, 3.3 V I/O
SEATING
PLANE
7
6
5
4
1.22
MAX
0.20
MAX, TYP
3
2
1
A
C
E
G
N
R
U
J
L
B
D
H
K
M
P
V
F
T
REV. A
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