TS86101G2BCGL E2V, TS86101G2BCGL Datasheet - Page 26

• Manufacturer Part Number: TS86101G2BCGL
• Manufacturer: E2V

Specifications of TS86101G2BCGL

• Lead Free Status / RoHS Status: Not Compliant

6.4
26
Diode Pin for Die Junction Temperature Monitoring Function
0992D–BDC–04/09
Figure 6-3.
The diode pin is provided for the die junction temperature monitoring function.
Figure 6-4.
For a given forced current in the diode pin, the voltage across the diode-mounted transistor is linearly
dependent on the temperature. Since the characteristic of the diode may vary from one device to
another, the voltage across the diode must first be measured to obtain a junction temperature.
Once the diode-mounted transistor is measured, Vbe values according to the junction temperature at l =
1 mA are given in
Synchronization of the MUXDAC with DSP/FPGA/ASIC Circuit
Die Junction Temperature Monitoring
MUXDAC
Figure 6-5 on page
FPGA
Diode Pin
CS_3 Control
CS_0 Control
27.
Open or GND
Open or GND
GND
GND
Protection Diodes
CS_0
CS_3
MUXDAC
e2v semiconductors SAS 2009
TS86101G2B
V