TS86101G2BCGL E2V, TS86101G2BCGL Datasheet - Page 48

• Manufacturer Part Number: TS86101G2BCGL
• Manufacturer: E2V

Specifications of TS86101G2BCGL

• Lead Free Status / RoHS Status: Not Compliant

48
0992D–BDC–04/09
Figure 13-3. CBGA 255 Package Outline – Cross Section
Figure 13-4. CBGA 255 Side View after Reflow
Note:
0.55 +/- 0.10
After reflow, the height of the balls decreases from 0.65 to 0.55 mm because of the package weight. The
diameter increases from 0.80 to 0.85 mm. This data is for information only and does not constitute part of
e2v’s specification.
0.85 mm
+/- 0.10
0.80 mm
+/- 0.10
Hermetically soldered to package
Metallic lid 0.381 mm thickness
(Kovar, Ni-Au plated)
16.64 mm
Grounded
AI203 Ceramic
Package
2
lid
e2v semiconductors SAS 2009
TS86101G2B
Eutectic Solder
Eutectic Solder
Sn63Pb37
Sn63Pb37
Balls
0.20
0.40
0.20
0.25
0.50
Balls
0.10
0.15