FDC37M817-MS Standard Microsystems (SMSC), FDC37M817-MS Datasheet - Page 197

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FDC37M817-MS

Manufacturer Part Number
FDC37M817-MS
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of FDC37M817-MS

Pin Count
100
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDC37M817-MS
Manufacturer:
Microchip Technology
Quantity:
10 000
TD(1)
TE(1)
TD(2)
TE(2)
-C-
DIM
A1
A2
D1
E1
L1
W
D
H
A
E
L
e
0
H
0.10
E
A
22.21
16.27
21.8
15.8
M IN
2.80
2.57
23.4
19.9
17.4
13.9
0.65
0.1
0.1
1.8
.2
A1
0.65 BSC
FIGURE 25 - 100 PIN QFP PACKAGE OUTLINE
E1
A2
22.76
16.82
24.15
18.15
M AX
3.15
0.45
2.87
20.1
14.1
0.95
22.2
16.2
0.2
2.6
12°
.4
M IN
.110
.004
.101
.921
.783
.685
.547
.004
.026
.071
.008
.858
.622
.874
.641
.0256 BSC
M AX
.124
.018
.113
.951
.791
.715
.555
.008
.037
.102
.016
.874
.638
.896
.662
TD/TE
197
12°
D1
D
Notes:
1) Coplanarity is 0.100m m (.004") m ax im um .
2) Toleranc e on the position of the leads is
0.200m m (.008") m axim um .
3) Package body dim ens ions D1 and E1 do not
include the m old protrusion. M axim um m old
protrus ion is 0.25m m (.010").
4) Dim ensions TD and TE are im portant for testing
by robotic handler. Only above com binations of (1)
or (2) are acc eptable.
5) Controlling dim ens ion: m illim eter. Dim ens ions
in inches for reference only and not nec ess arily
acc urate.
L1
L
0
e
W

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