SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 20
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SC2200UFH-300
Manufacturer Part Number
SC2200UFH-300
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.SC2200UFH-300.pdf
(429 pages)
Specifications of SC2200UFH-300
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC2200UFH-300F
Manufacturer:
NSC
Quantity:
201
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20
GX_BASE+8408h-840Bh
GX_BASE+840Ch-840Fh
31:16
30:28
27:24
23:20
18:16
14:12
10:8
Bit
6:4
3:0
15
14
13
12
11
31
19
15
7
Description
RSVD (Reserved). Write as 0070h
RSVD (Reserved). Write as 0.
SODIMM_MOD_BNK (SODIMM Module Banks - Banks 0 and 1). Selects number of module banks installed per SODIMM
for SODIMM:
0: 1 Module bank (Bank 0 only).
1: 2 Module banks (Bank 0 and 1).
RSVD (Reserved). Write as 0.
SODIMM_COMP_BNK (SODIMM Component Banks - Banks 0 and 1). Selects the number of component banks per
module bank for SODIMM:
0: 2 Component banks.
1: 4 Component banks.
Banks 0 and 1 must have the same number of component banks.
RSVD (Reserved). Write as 0.
SODIMM_SZ (SODIMM Size - Banks 0 and 1). Selects the size of SODIMM:
000: 4 MB
001: 8 MB
This size is the total of both banks 0 and 1. Also, banks 0 and 1 must be the same size.
RSVD (Reserved). Write as 0.
SODIMM_PG_SZ (SODIMM Page Size - Banks 0 and 1). Selects the page size of SODIMM:
000: 1 KB
001: 2 KB
Both banks 0 and 1 must have the same page size.
RSVD (Reserved). Write as 0.
RSVD (Reserved). Write as 0.
LTMODE (CAS Latency). CAS latency is the delay, in SDRAM clock cycles, between the registration of a read command
and the availability of the first piece of output data. This parameter significantly affects system performance. Optimal setting
should be used. If an SODIMM is used, BIOS can interrogate EEPROM across the ACCESS.bus interface to determine this
value:
000: Reserved
001: Reserved
This field will not take effect until SDRAMPRG (bit 0 of MC_MEM_CNTRL1) transitions from 0 to 1.
RC (RFSH to RFSH/ACT Command Period, tRC). Minimum number of SDRAM clock between RFSH and RFSH/ACT
commands:
0000: Reserved
0001: 2 CLK
0010: 3 CLK
0011: 4 CLK
RAS (ACT to PRE Command Period, tRAS). Minimum number of SDRAM clocks between ACT and PRE commands:
0000: Reserved
0001: 2 CLK
0010: 3 CLK
0011: 4 CLK
RSVD (Reserved). Write as 0.
RP (PRE to ACT Command Period, tRP). Minimum number of SDRAM clocks between PRE and ACT commands:
000: Reserved
001: 1 CLK
RSVD (Reserved). Write as 0.
RCD (Delay Time ACT to READ/WRT Command, tRCD). Minimum number of SDRAM clock between ACT and READ/
WRT commands. This parameter significantly affects system performance. Optimal setting should be used:
000: Reserved
001: 1 CLK
32580B
Table 2-2. SC2200 Memory Controller Registers (Continued)
010: 16 MB
011: 32 MB
010: 4 KB
011: 8 KB
010: 2 CLK
011: 3 CLK
0100: 5 CLK
0101: 6 CLK
0110: 7 CLK
0111: 8 CLK
0100: 5 CLK
0101: 6 CLK
0110: 7 CLK
0111: 8 CLK
010: 2 CLK
011: 3 CLK
010: 2 CLK
011: 3 CLK
100: 64 MB
101: 128 MB
1xx: 16 KB
111: SODIMM not installed
100: 4 CLK
101: 5 CLK
1000: 9 CLK
1001: 10 CLK
1010: 11 CLK
1011: 12 CLK
1000: 9 CLK
1001: 10 CLK
1010: 11 CLK
1011: 12 CLK
100: 4 CLK
101: 5 CLK
100: 4 CLK
101: 5 CLK
MC_BANK_CFG (R/W)
MC_SYNC_TIM1 (R/W)
110: 256 MB
111: 512 MB
110: 6 CLK
111: 7 CLK
1100: 13 CLK
1101: 14 CLK
1110: 15 CLK
1111: 16 CLK
1100: 13 CLK
1101: 14 CLK
1110: 15 CLK
1111: 16 CLK
110: 6 CLK
111: 7 CLK
110: 6 CLK
111: 7 CLK
AMD Geode™ SC2200 Processor Data Book
Reset Value: 2A733225h
Reset Value: 41104110h
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