MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 25

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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8.2.2.1
Table 21
Figure 8
Figure 9
Freescale Semiconductor
At recommended operating conditions with LV
RX_CLK clock period
RX_CLK duty cycle
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
RX_CLK clock rise and fall time
Note:
1. The symbols used for timing specifications herein follow the pattern of t
2. Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3. Guaranteed by design.
(reference)(state)
symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to
the t
with respect to the time data input signals (D) went invalid (X) relative to the t
state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing
the clock of a particular functional. For example, the subscript of t
and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
RX
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
provides the AC test load for TSEC.
shows the GMII receive AC timing diagram.
provides the GMII receive AC timing specifications.
clock reference (K) going to the high state (H) or setup time. Also, t
GMII Receive AC Timing Specifications
for inputs and t
Parameter/Condition
RXD[7:0]
RX_CLK
RX_DV
RX_ER
Output
(first two letters of functional block)(reference)(state)(signal)(state)
Table 21. GMII Receive AC Timing Specifications
Figure 9. GMII Receive AC Timing Diagram
t
t
GRXH
GRDVKH
DD
of 3.3 V ± 5%.
Figure 8. TSEC AC Test Load
t
GRX
Z
0
= 50 Ω
t
GRXR
t
Symbol
GRXH
t
t
GRDXKH
GRDVKH
t
GRXF
t
, t
GRX
GRXF
/t
GRX
t
GRX
GRDXKH
1
represents the GMII (G) receive (RX) clock. For rise
2,3
(first two letters of functional block)(signal)(state)
R
GRDXKL
L
t
GRXR
= 50 Ω
GRX
Min
2.0
0.5
40
clock reference (K) going to the low (L)
symbolizes GMII receive timing (GR)
for outputs. For example, t
Ethernet: Three-Speed, MII Management
LV
DD
Typ
8.0
/2
Max
1.0
60
GRDVKH
Unit
ns
ns
ns
ns
%
25

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