MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 57

• Manufacturer Part Number: MPC855TCVR50D4
• Description: IC MPU POWERQUICC 50MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC855TCVR50D4

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Operating Supply Voltage: 2.5 V, 3.3 V
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: -40C to 95C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

14.2
Figure 42
package.
Notes:
Freescale Semiconductor
1.
2.
3.
4.
5.
6.
7.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
The socket lid must always be oriented to A1.
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Mechanical Dimensions of the FC-PBGA
Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8555E 783 FC-PBGA
Package and Pin Listings
57