MPC855TCVR50D4 Freescale Semiconductor, MPC855TCVR50D4 Datasheet - Page 5

IC MPU POWERQUICC 50MHZ 357PBGA

MPC855TCVR50D4

Manufacturer Part Number
MPC855TCVR50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor

Specifications of MPC855TCVR50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC855TCVR50D4
Manufacturer:
FREESCAL
Quantity:
246
Part Number:
MPC855TCVR50D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC855TCVR50D4R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor
— Can be partitioned into 128-Kbyte L2 cache plus 128-Kbyte SRAM
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— SRAM operation supports relocation and is byte-accessible
— Cache mode supports instruction caching, data caching, or both
— External masters can force data to be allocated into the cache through programmed memory
— Eight-way set-associative cache organization (1024 sets of 32-byte cache lines)
— Supports locking the entire cache or selected lines
— Global locking and flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be flash cleared separately
— Read and write buffering for internal bus accesses
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 32-bit address space
— Inbound and outbound ATMUs map to larger external address spaces
DDR memory controller
— Programmable timing supporting first generation DDR SDRAM
— 64-bit data interface, up to MHz data rate
— Four banks of memory supported, each up to 1 Gbyte
— DRAM chip configurations from 64 Mbits to 1 Gbit with x8/x16 data ports
— Full ECC support
— Page mode support (up to 16 simultaneous open pages)
— Contiguous or discontiguous memory mapping
— Sleep mode support for self refresh DDR SDRAM
— Supports auto refreshing
— On-the-fly power management using CKE signal
— Registered DIMM support
— Fast memory access via JTAG port
— 2.5-V SSTL2 compatible I/O
Programmable interrupt controller (PIC)
— Programming model is compliant with the OpenPIC architecture
— Supports 16 programmable interrupt and processor task priority levels
— Supports 12 discrete external interrupts
— Supports 4 message interrupts with 32-bit messages
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
ranges or special transaction types (stashing).
– Individual line locks set and cleared through Book E instructions or by externally mastered
– Three inbound windows plus a configuration window on PCI
– Four inbound windows
– Four outbound windows plus default translation for PCI
transactions
Overview
5

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