STM32W108CC STMicroelectronics, STM32W108CC Datasheet - Page 225

• Manufacturer Part Number: STM32W108CC
• Description: High-performance, IEEE 802.15.4 wireless system-on-chip with embedded Flash memory
• Manufacturer: STMicroelectronics

Specifications of STM32W108CC

• Receive Current (w/ Cpu): 27 mA
• Transmit Current (w/ Cpu, +3 Dbm Tx): 31 mA
• Low Deep Sleep Current, With Retained Ram And Gpio: 400 nA/800 nA with/without sleep timer
• Standard Arm Debug Capabilities: Flash patch & breakpoint; data watchpoint & trace; instrumentation trace macrocell
• Single Voltage Operation: 2.1-3.6 V with internal 1.8 V and 1.25 V regulators

STM32W108HB STM32W108CC STM32W108CB STM32W108CZ
Figure 60. UFQFPN48 7x7 mm pitch 0.5 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
laser marking area
Z
Pin 1 indentifier
Exposed pad
solder this back-sidepad to PCB ground.
area
1
48
D
D
D2
Doc ID 16252 Rev 13
E
Y
E2
E
T
C 0.500x45°
pin1 corner
1
e
Detail Y
Detail Z
48
Package characteristics
b
ddd
R 0.125 typ.
L
A1
A0B9_ME_V3
225/232
A
Seating
plane