TS68EN360MAB Atmel Corporation, TS68EN360MAB Datasheet - Page 12

• Manufacturer Part Number: TS68EN360MAB
• Description: 32-bit Communication Controller, 25 or 33 MHz
• Manufacturer: Atmel Corporation

5.3
12
Power Considerations
TS68EN360
This device contains protective circuitry against damage due to high static voltages or electrical
fields; however, it is advised that normal precautions be taken to avoid application of any volt-
ages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation
is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either GND or
V
Table 5-2.
Table 5-3.
T
P
Where P
The average chip-junction temperature, T
where:
For most applications, P
Symbol
V
V
V
T
V
f
Symbol
θ
θ
J
DD
D
sys
JC
JA
case
CC
IL
IH
OH
= T
= (V
)
A
T
T
Θ
Junction-to-Ambient, C/W
P
P
P
A
DD
J
D
INT
I/O
+ (P
JA
I/O
= T
= Ambient Temperature, °C
= P
= Power Dissipation on Input and Output Pins-User Determined
= Package Thermal Resistance,
· I
= I
is the power dissipation on pins.
A
D
DD
Parameter
Thermal Resistance - Junction to Case
Thermal Resistance - Junction to Ambient
INT
Parameter
Supply Voltage Range
Logic Low Level Input Voltage Range
Logic High Level Input Voltage Range
Operating Temperature
High Level Output Voltage
System Frequency
CC
÷ (P
· θ
) + P
Recommended Conditions of Use
Unless otherwise stated, all voltages are referenced to the reference terminal
Thermal Characteristics
+ P
· V
JA
D
)
CC
I/O
· Θ
I/O
, Watts-chip Internal Power
JA
)
I/O
< 0.3 · P
INT
(For 25 MHz version)
(For 33 MHz version)
and can be neglected.
J
, in °C can be obtained from:
(1)
240-pin Cerquad
240-pin Cerquad
241-pin PGA
241-pin PGA
+4.75
GND
+2.0
+2.4
Min
-55
Typ
25
33
Value
27.4
22.8
+5.25
+125
+0.8
Max
2113B–HIREL–06/05
V
2
7
CC
°C/W
°C/W
Unit
MHz
MHz
Unit
°C
V
V
V
V