pcf8833 NXP Semiconductors, pcf8833 Datasheet - Page 107
pcf8833
Manufacturer Part Number
pcf8833
Description
Stn Rgb - 132 X 132 X 3 Driver
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8833.pdf
(112 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
pcf8833U/2DC/1
Manufacturer:
TOSHIBA
Quantity:
32
Philips Semiconductors
Table 100 Bonding pad dimensions
2003 Feb 14
handbook, full pagewidth
Minimum bump pitch
Bump dimensions
Bump height
Wafer thickness (excluding bumps)
STN RGB - 132
Fig.61 Bonding pads dimensions.
ITEM
2.34
mm
132
handbook, halfpage
Fig.62 Alignment circle detail (80 m diameter).
3 driver
y
y
center
x
columns: 46.464
all other: 52.800
columns: 28.424
all other: 32.736
15
381
PC8833-1
22.93 mm
107
x
center
pitch
DIMENSIONS
MGU975
95.348
105.248
80
m
MGU974
Objective specification
PCF8833
m
m
m
m
UNIT
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