pcf8833 NXP Semiconductors, pcf8833 Datasheet - Page 96
pcf8833
Manufacturer Part Number
pcf8833
Description
Stn Rgb - 132 X 132 X 3 Driver
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8833.pdf
(112 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
pcf8833U/2DC/1
Manufacturer:
TOSHIBA
Quantity:
32
Philips Semiconductors
17 BONDING PAD INFORMATION
2003 Feb 14
handbook, full pagewidth
STN RGB - 132
V OTP(drain)
V OTP(gate)
V DD(tieoff)
D/C/SCLK
V SS(tieoff)
D0/SDIN
CS/SCE
pad 463
SDOUT
V DD1
V DD3
V DD2
V SS1
V SS2
OSC
RES
R63
R32
PS0
PS1
PS2
WR
RD
D7
D3
D6
D5
D2
D1
D4
TE
T6
T5
T4
T3
T2
T1
active pads
dummy pads
alignment marks
132
3 driver
Fig.60 Bonding pad location.
pad 462
R31
R0
C395
C384
C383
C336
C335
C288
C287
C240
C239
C192
96
V LCDSENSE
V LCDOUT1
V LCDOUT2
V SS(tieoff)
V LCDIN1
V LCDIN2
pad 769
C1
C1
C2
C2
C3
C3
C4
C4
C5
C5
R131
V1H
V2H
V2L
V1L
VC
R96
T7
MGU976
C191
C144
C143
C96
C95
C48
C47
C0
R64
R95
pad 1
Objective specification
PCF8833
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