pcf8833 NXP Semiconductors, pcf8833 Datasheet - Page 108
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
pcf8833
Manufacturer Part Number
pcf8833
Description
Stn Rgb - 132 X 132 X 3 Driver
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8833.pdf
(112 pages)
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
pcf8833U/2DC/1
Manufacturer:
TOSHIBA
Quantity:
32
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Philips Semiconductors
18 TRAY INFORMATION
2003 Feb 14
handbook, full pagewidth
handbook, halfpage
STN RGB - 132
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.
Fig.64 Tray alignment.
y
132
F
x
3 driver
MGU980
Fig.63 Tray details.
108
C
E
Table 101 Tray dimensions
DIMENSIONS
B
C
D
E
F
x
y
pocket pitch y direction
pocket width x direction
pocket width y direction
tray width x direction
tray width y direction
number of pockets in
x direction
number of pockets in
y direction
MGU979
DESCRIPTION
D
B
Objective specification
PCF8833
23.07 mm
4.45 mm
2.47 mm
50.8 mm
50.8 mm
VALUE
10
1
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