tza3015hw NXP Semiconductors, tza3015hw Datasheet - Page 48

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tza3015hw

Manufacturer Part Number
tza3015hw
Description
30 Mbit/s To 3.2 Gbit/s A-rate 4-bit Fibre Optic Transceiver
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
tza3015hw/N1
Manufacturer:
SAMSUNG
Quantity:
9 600
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
Notes
1. In compliance with JEDEC standards JESD51-5 and JESD51-7.
2. Four-layer Printed-Circuit Board (PCB) in still air with 36 plated vias connected with the heatsink and the second and
2003 Dec 16
V
V
V
I
T
T
T
R
n
amb
j
stg
CC
DD
n
th(j-a)
30 Mbit/s to 3.2 Gbit/s A-rate
4-bit fibre optic transceiver
SYMBOL
SYMBOL
fourth layer in the PCB.
analog supply voltage
digital supply voltage
DC voltage
input current
ambient temperature
junction temperature
storage temperature
thermal resistance from junction to ambient
on pins RXPC(Q), RXPD0(Q) to RXPD3(Q), RXFP(Q),
RXPAR(Q), TXPARERR(Q), TXPCO(Q), RXPRSCL(Q) and
TXPRSCL(Q)
on pins RXSD(Q), CREF(Q), TXPC(Q), TXPD0(Q) to TXPD3(Q),
TXPAR(Q), UI, RREF, LOSTH, RSSI, LOS, CS, SDA, SCL, LM0
to LM2, INT, ENRX, ENTX, WINSIZE, INWINDOW, ENDDR,
LOWSWING, ENBA, PAREVEN, OVERFLOW, FIFORESET,
ENTXSC, TXSD(Q), TXSC(Q), LOL, FREF0, FREF1, CLKDIR
and IPUMP
on pins RXPC(Q), RXPD0(Q) to RXPD3(Q), RXFP(Q),
RXPAR(Q), TXPARERR(Q), TXPCO(Q), RXPRSCL(Q) and
TXPRSCL(Q)
on pins RXSD(Q) and CREF(Q)
on pin INT
on pins TXPC(Q), TXPD0(Q) to TXPD3(Q) and TXPAR(Q)
PARAMETER
PARAMETER
48
notes 1 and 2
CONDITIONS
0.7
0.5
0.5
0.5
20
30
2
25
40
65
MIN.
VALUE
16
Preliminary specification
+3.6
+3.6
V
V
+20
+30
+2
+25
125
TZA3015HW
85
150
CC
CC
MAX.
+ 0.5 V
+ 0.5 V
UNIT
V
V
mA
mA
mA
mA
K/W
C
C
C
UNIT

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