tmp89fm82t TOSHIBA Semiconductor CORPORATION, tmp89fm82t Datasheet - Page 453
tmp89fm82t
Manufacturer Part Number
tmp89fm82t
Description
8 Bit Microcontroller
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TMP89FM82T.pdf
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25.10
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Handling Precaution
The solderability test conditions are shown below.
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
recommend electrically shielding the package in order to maintain normal operating condition.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
The pass criteron of the above test is as follows: Solderability rate until forming ≥ 95%
Solder bath temperature = 230°C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245°C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Page 437
TMP89FM82T
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